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US 2009/0243120 A1Published application
Semiconductor element and semiconductor element fabrication method
AssigneePanasonic Corporation
InventorsTakeshi KITA, Kazushi HIGASHI
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Abstract
A semiconductor element is provided that includes a semiconductor substrate, a circuit element disposed on the substrate, and a through-hole formed in the substrate having a stripe-like concavo-convex structure on its sidewall with stripes formed in the direction of the thickness of the semiconductor substrate.
Claims14
A semiconductor element comprising:
- a semiconductor substrate;
- a circuit element disposed on the semiconductor substrate;
- and
- a through-hole formed in the semiconductor substrate and having a stripe-like concavo-convex structure on its sidewall;
- wherein stripes of the stripe-like concavo-convex structure are formed in a direction of a thickness of the semiconductor substrate.
2 more elements
A semiconductor element fabrication method comprising the steps of:
- forming, while forming a through-hole in a material of a semiconductor substrate, a stripe-like concavo-convex structure on a sidewall of the through-hole, stripes of the stripe-like concavo-convex structure being formed in a direction of a thickness of the material of the semiconductor substrate;
- forming a conductive material inside the through-hole;
- and
- electrically connecting the conductive material to an electrode of a circuit element.
1 more element
Dependencies are inferred from the claim text.