Semiconductor device and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsMyoung-jae Lee, Young-soo Park, Chang-bum Lee, Seung-eon Ahn, Ki-hwan Kim, Bo-soo Kang
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Abstract
Provided are a semiconductor device and a method of manufacturing the same. The semiconductor device includes: a memory array on a first substrate; and a peripheral circuit on a second substrate, wherein the first substrate and the second substrate may be attached to each other so that the memory array and the peripheral circuit are electrically connected to each other.
Claims29
A semiconductor device comprising:
- a first memory array on a first substrate;
- and
- a peripheral circuit on a second substrate,wherein the first memory array and the peripheral circuit are electrically connected to each other.
A semiconductor device comprising:
- a first memory array on a first surface of a substrate;
- and
- a peripheral circuit on a second surface of the substrate, wherein the second surface is opposite the first surface of the substrate.
A method of manufacturing a semiconductor device, the method comprising:
- forming a first memory array on a first substrate;
- forming a peripheral circuit on a second substrate;
- and
- electrically connecting the first memory array and the peripheral circuit.
A method of manufacturing a semiconductor device, the method comprising:
- forming a memory array on a first surface of a substrate;
- forming a peripheral circuit on a second surface of the substrate, the second surface being opposite the first surface of the substrate;
- and
- electrically connecting the memory array to the peripheral circuit.
Dependencies are inferred from the claim text.