Methods to Form a Three-Dimensionally Curved Pad in a Substrate and Integrated Circuits Incorporating such a Substrate
OwnerJotaro Akiyamainventor
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Abstract
Methods to form a three-dimensionally curved pad in a substrate and integrated circuits incorporating such a substrate are disclosed. An example method to form a three-dimensionally curved pad comprises isotropically etching a portion of a surface of a substrate to form a recess having a radial shape, forming a conductive layer in the recess to form the bonding pad, and placing a conductive element in the pad.
Claims25
A method of forming a bonding pad in a packaged integrated circuit, comprising:
- isotropically etching a portion of a surface of a substrate to form a recess having a radial shape;
- forming a conductive layer in the recess to form the bonding pad;
- and
- placing a conductive element in the pad.
A method as defined in claim 9, wherein the parameters comprise a material of the substrate and a time the substrate is exposed to the etchant.
A packaged integrated circuit, comprising:
- an integrated circuit attached to a first surface of a substrate, the substrate defining a recess having a three-dimensionally curved, radial shape on a second surface opposite the first surface;
- a conductive pad in the recess having a radial shape corresponding to the recess;
- and
- a conductive element in the recess, the conductive element being electrically coupled to the integrated circuit by a via through the substrate.
A packaged integrated circuit, comprising:
- a first substrate having one or more active devices on a first surface, the first substrate defining one or more recesses having a three-dimensionally curved, radial shape on a second surface opposite the first surface and conductive pads in the recesses having a radial shape corresponding to the recesses, conductive elements located in corresponding ones of the recesses;
- a second substrate having a first surface to receive the conductive elements of the first substrate and a second surface opposite the first surface having one or more contacts electrically coupled to the active devices of the first substrate;
- and
- an encapsulant to encapsulate the first and second substrates, wherein the contacts of the second substrate are exposed on one or more surfaces of the packaged integrated circuit.
Dependencies are inferred from the claim text.