Through Hole Vias at Saw Streets Including Protrusions or Recesses for Interconnection

A semiconductor package, comprising:

• a semiconductor die having a contact pad formed over a top surface of the semiconductor die;
• an insulating material deposited around a portion of the semiconductor die;
• and
• a first through hole via (THV) formed in the insulating material using a conductive material, the first THV being recessed within the semiconductor die for package interconnect.

A semiconductor package, comprising:

• a first semiconductor device, the first semiconductor device including,
• a semiconductor die having a contact pad formed over a top surface of the semiconductor die,
• an insulating material deposited around a portion of the semiconductor die, and
• a through hole via (THV) formed in the insulating material using a conductive material, the THV forming a protrusion extending beyond a surface of the semiconductor die for package interconnect;
• and
• a second semiconductor device, the second semiconductor device including,
• a semiconductor die having a contact pad formed over a top surface of the semiconductor die,
• an insulating material deposited around a portion of the semiconductor die, and
• a THV formed in the insulating material using a conductive material, the THV being recessed within the semiconductor die for package interconnect, wherein the protruding THV of the first semiconductor device is connected to the recessed THV of the second semiconductor device.

A method of making a semiconductor package, comprising:

• providing a wafer having a plurality of semiconductor dies;
• forming gaps between the semiconductor dies;
• depositing insulating material around a portion of one of the semiconductor dies;
• etching a through hole in the insulating material;
• depositing conductive material into the through hole to form a through hole via (THV), the THV including a protrusion or a recess with respect to a surface of the semiconductor die for package interconnect;
• and
• singulating through the insulating material to separate the semiconductor die.