US 2009/0242524 A1 · SINGULATION APPARATUS FOR MANUFACTURING ELECTRONIC COMPONENT

Abstract

Regarding a singulation apparatus for singulating a resin encapsulated substrate to manufacture an electronic component, the present invention brings about shortening the delivery period, reducing the footprint, and reducing the cost in compliance with a specification requested by a user. A singulation apparatus for an electronic component has: a basic unit including a receiving unit, singulation unit, and delivery unit; a cleaning unit mounted between the singulation unit and the delivery unit; and an examination unit mounted on the cleaning unit. The singulation unit is appropriately selected in accordance with the requested specification by the user, and a cutting mechanism used in the singulation unit has a rotary blade, water jet, laser light, wire saw, band saw, etc. The cleaning unit and examination unit, both mounted on the basic unit, are each appropriately selected and mounted in accordance with the requested specification by the user. The cleaning unit and examination unit are mounted on the basic unit which has the singulation unit in accordance with the requested specification by the user to form the singulation apparatus for an electronic component.

Claims18

Dependent claims

-5. (canceled)

A singulation apparatus for manufacturing an electronic component, the singulation apparatus being used for manufacturing a plurality of electronic components by resin-encapsulating semiconductor chips or other elements, each mounted on each of a plurality of areas provided on a substrate, to form a resin encapsulated substrate, and then singulating the resin encapsulated substrate by each area, comprising as compositional units:

a receiving unit for receiving the resin encapsulated substrate;
a singulation unit for singulating the resin encapsulated substrate;
and
a delivery unit for delivering the plurality of electronic components formed by singulation,
wherein at least one of the receiving unit, the singulation unit, and the delivery unit is previously prepared in a plurality of kinds to have different specifications in accordance with an expected request, and each compositional unit is attachable, detachable, and exchangeable with other compositional units.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

12/438,196Filed 7 Nov 2007

Priority

JP 2006-34218020 Dec 2006

Published

1 Oct 2009

Term ends

Not estimatedThe source records don’t support an estimate.

Classification8 codes

H10P 72/0428
Apparatus for manufacture or treatment: apparatus for mechanical treatment or grinding or cutting
H10P 72/0468
Apparatus for manufacturing or treating in a plurality of work-stations: comprising a chamber adapted to a particular process
G01N 21/956
Characterised by the material or shape of the object to be examined: inspecting patterns on the surface of objects
Y10T 29/53087
Means to assemble or disassemble: with signal, scale, illuminator, or optical viewer

Singulation apparatus for manufacturing electronic component

Life of this patent

Singulation apparatus for manufacturing electronic component

Life of this patent

Abstract

Claims18