Laser processing method
AssigneeSumitomo Electric Industries, Ltd.
InventorsKazuo Nakamae, Motoki Kakui, Shinobu Tamaoki
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AssigneeSumitomo Electric Industries, Ltd.
InventorsKazuo Nakamae, Motoki Kakui, Shinobu Tamaoki
Estimating the term…
The present invention relates to a laser processing method that makes it possible to effectively suppress the generation of surface irregularities on the surface of a plastic member where a metal member and a plastic member are joined together. In the laser processing method, a plurality of laser beams are irradiated from different directions so as to focus on the vicinity of an interface between the metal member and the plastic member, which are in contact with one another. The power densities of the respective laser beams at this time are set to a level not more than a level, at which the exposed surface of the plastic member on the side opposite to the interface between the metal member and the plastic member, does not melt. As a result of this, air bubbles or the like are not generated in the vicinity of the exposed surface of the plastic member, and the generation of surface roughness on the exposed surface of the plastic member is effectively suppressed.
A laser processing method, comprising the steps of:
Dependencies are inferred from the claim text.