Field effect electron emitting apparatus
AssigneeSony Corporation
InventorsWei Beng NG, Takehisa Ishida
Life of this patent
Estimating the term…
Abstract
A field effect electron emitting apparatus comprising a substrate, a plurality of wires embedded in the substrate, at least a portion of each wire being exposed from the substrate and extending generally perpendicularly therefrom and including magnetic material, wherein the average wire spacing is less than 30 μm, the average spacing height ratio is between 1 and 3 and the average wire aspect ratio is greater than 3. Also a method of manufacturing an electron emitting apparatus, a field effect display having such a field effect electron emitting apparatus, an illumination apparatus having such a field effect electron emitting apparatus, and a backlight apparatus for a liquid crystal display having such a field effect electron emitting apparatus.
Claims26
A field effect electron emitting apparatus comprising:
- a substrate,
- a plurality of wires embedded in the substrate, at least a portion of each wire being exposed from the substrate and extending generally perpendicularly therefrom and including magnetic material,
- wherein the average wire spacing is less than 30 μm, the average spacing height ratio is between 1 and 3 and the average wire aspect ratio is greater than 3.
The apparatus as claimed in any preceding claim wherein the average diameter of the plurality of wires is less than 3 μm.
The apparatus as claimed in any preceding claim further comprising:
- an insulating layer on or adjacent to a cathode and having an array of pores, and
- one or more gate electrodes on top of said insulating layer.
The apparatus as claimed in any preceding claim wherein the material of the plurality of wire includes at one or more of:
- Ni, Fe and Co.
The apparatus as claimed in any preceding claim further comprising:
- a plurality of cathodes, the plurality of wires being partitioned into regions, each region being in electrical contact with a respective cathode.
The apparatus as claimed in any preceding claim further comprising a metal layer on the substrate in which the base of each wire is embedded.
A method of manufacturing an electron emitting apparatus, the method comprising:
- contacting a substrate with a plating solution comprising a magnetic wire concentration of between 107/ml and 4×108/ml in the presence of a magnetic field perpendicular to a major surface of the substrate;
- plating a metal layer onto the major surface of the substrate, thereby embedding a plurality of the magnetic wires into the metal layer.
Dependencies are inferred from the claim text.