Portable electronic apparatus
AssigneeHTC Corporation
InventorsYi-Chang Huang, Yao-Chung Lin
Life of this patent
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Abstract
A portable electronic apparatus comprises a housing, a circuit board, a heat-conduction structure and a heat-dissipation structure. The circuit board is disposed in the housing and comprises a substrate and a first electronic device, wherein the first electronic device is disposed on the substrate. The heat-conduction structure is disposed on the circuit board, and dissipates heat from the first electronic device. The heat-dissipation structure is disposed on the housing and connected to the heat-conduction structure, wherein the heat passes the heat-conduction structure and the heat-dissipation structure, and is dissipated out of the housing.
Claims6
A cell phone, comprising:
- a housing;
- a circuit board, disposed in the housing and comprising a substrate, a first electronic device and a second electronic device, wherein the first electronic device and the second electronic device are disposed on the substrate;
- a heat-conduction structure, detachably disposed on the circuit board in the housing for dissipating a heat from the first electronic device, wherein the heat-conduction structure is an isolation cover, and the isolation cover comprises a spacer disposed between the first electronic device and the second electronic device isolating the first electronic device from the second electronic device, wherein a material of the heat-conduction structure comprises metal;
- a sliding cover;
- and
- a heat-dissipation structure disposed on the housing and connected to the heat-conduction structure for dissipating the heat out of the housing from the heat-conduction structure, wherein the heat-dissipation structure is disposed on a surface of the sliding cover.
A heat-dissipation module for dissipating a heat from a circuit board disposed in a housing of a cell phone, the circuit board comprising a substrate, a first electronic device and a second electronic device, the first electronic device and the second electronic device disposed on the substrate, the heat-dissipation module comprising:
- a heat-conduction structure, detachably disposed on the circuit board for dissipating the heat from the first electronic device, wherein the heat-conduction structure is an isolation cover, and the isolation cover comprises a spacer disposed in the isolation cover between the first electronic device and the second electronic device and isolating the first electronic device from the second electronic device, wherein a material of the heat-conduction structure comprises metal;
- and
- a heat-dissipation structure connected to the heat-conduction structure for dissipating the heat from the heat-conduction structure, wherein the heat-dissipation structure is disposed on a surface of a sliding cover of the cell phone.
Dependencies are inferred from the claim text.