Method for manufacturing light-emitting device
AssigneeSeiko Epson Corporation
InventorKazunori SAKURAI
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AssigneeSeiko Epson Corporation
InventorKazunori SAKURAI
Estimating the term…
A method for manufacturing a light-emitting device includes a first step of forming at least one light-emitting element on a first substrate; a second step of applying a resin adhesive to a first application area that includes an area where the at least one light-emitting element is formed, so as to cover the at least one light-emitting element; a third step of applying a glass frit paste on a surface of the first substrate where the at least one light-emitting element is formed or on a second substrate and also to a second application area that surrounds the area where the at least one light-emitting element is formed; a fourth step of laminating the first substrate and the second substrate; a resin curing step of curing the resin adhesive to bond the first substrate and the second substrate in the first application area and to seal the at least one light-emitting element from an outside; and a glass frit melting step of melting the glass frit paste to bond the first substrate and the second substrate in the second application area.
A method for manufacturing a light-emitting device comprising:
Dependencies are inferred from the claim text.