Process for selective growth of films during ecp plating
AssigneeApplied Materials, Inc.
InventorsJick M. Yu, Wei D. Wang, Rongjun Wang, Hua Chung
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Abstract
Methods of controlling deposition of metal on field regions of a substrate in an electroplating process are provided. In one aspect, a dielectric layer is deposited under plasma on the field region of a patterned substrate, leaving a conductive surface exposed in the openings. Electroplating on the field region is reduced or eliminated, resulting in void-free features and minimal excess plating. In another aspect, a resistive layer, which may be a metal, is used in place of the dielectric. In a further aspect, the surface of the conductive field region is modified to change its chemical potential relative to the sidewalls and bottoms of the openings.
Claims20
A method of processing a patterned substrate having a field region and openings in the field region, comprising:
- forming a conductive seed layer on the field regions and openings;
- forming one or more dielectric layers in the presence of RF power on portions of the conductive seed layer formed on the field region;
- and
- depositing a conductive material on the conductive seed layer in at least some of the openings by an electroplating process.
A method of processing a substrate having openings and field regions, comprising:
- depositing a barrier layer over the openings and field regions;
- depositing a seed layer over the openings and field regions;
- forming a resistive layer on the portion of the seed layer deposited over the field regions;
- filling the openings with a conductive material by an electroplating process;
- and
- planarizing the substrate.
A method of filling one or more openings formed in a field region of a substrate with a conductive material, comprising:
- forming a conductive layer over the openings and field region;
- depositing an insulating layer on the field region in the presence of RF power;
- removing a portion of the insulating layer;
- filling at least a portion of the one or more openings with conductive material by exposing at least a portion of the substrate to an electrolyte solution;
- and
- planarizing the substrate.
Dependencies are inferred from the claim text.