Chip Scale Package Fabrication Methods
AssigneeShanghai Kaihong Technology Co., Ltd.
InventorsXiaochun Tan, Jun Guo
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Abstract
Embodiments of the present invention includes a method of assembling a chip scale package (CSP). The method comprises adding bumps, sawing the saw streets from the front of a wafer, molding the front of the wafer, grinding the back of the wafer, sawing the saw streets from the back of the wafer, molding the back of the wafer, and sawing between devices to form a plurality of packaged devices. Sawing the saw streets from the front of the wafer establishes a first cut. Molding the front of the wafer includes using a first mold compound such that the mold compound fills in the first cut. Sawing the saw streets from the back of the wafer establishes a second cut.
Claims20
A method of assembling a chip scale package (CSP) comprising:
- adding conductive bumps to a plurality of contact locations on a front of a wafer having a plurality of devices;
- sawing along a plurality of saw streets from the front of said wafer and in accordance therewith establishing a first cut;
- molding the front of said wafer with a first mold compound such that the mold compound fills in the first cut and covers the front side of the wafer leaving the bumps exposed;
- grinding a back of said wafer and in accordance therewith establishing a device width;
- sawing along the plurality of saw streets from the back of said wafer and in accordance therewith establishing a second cut;
- molding the back of said wafer with a second mold compound such that the second mold compound fills in the second cut and covers the back of said wafer;
- and
- sawing between the devices to form a plurality of packaged devices.
A method of assembling a chip scale package (CSP) comprising:
- adding a set of first conductive bumps to a plurality of contact locations on a front of a wafer having a plurality of devices;
- sawing along a plurality of saw streets from the front of said wafer and in accordance therewith establishing a first cut;
- sawing along the plurality of saw streets from the front of said wafer and in accordance therewith establishing a second cut;
- molding the front of said wafer with a first mold compound such that the mold compound fills in the first cut, fills in the second cut, and covers the front side of the wafer;
- grinding a back of said wafer and in accordance therewith establishing a device width and exposing the first mold compound within the second cut;
- molding the back of said wafer with a second mold compound such that the second mold compound adheres to the first mold compound within the second cut and covers the back of said wafer;
- adding a set of second conductive bumps on top of the set of first conductive bumps;
- and
- sawing between the plurality of devices to form a plurality of packaged devices.
A method of assembling a chip scale package (CSP) comprising:
- adding conductive bumps to a plurality of contact locations on a front of a wafer having a plurality of devices;
- sawing along a plurality of saw streets from the front of said wafer and in accordance therewith establishing a first cut;
- sawing along the plurality of saw streets from the front of said wafer and in accordance therewith establishing a second cut;
- molding the front of said wafer with a first mold compound such that the mold compound fills in the first cut, fills in the second cut, and covers the front side of the wafer leaving the conductive bumps exposed;
- removing an excess of mold compound around the plurality of contact locations;
- grinding a back of said wafer and in accordance therewith establishing the device width and exposing the first mold compound within the second cut;
- molding the back of said wafer with a second mold compound such that the second mold compound adheres to the first mold compound within the second cut and covers the back of said wafer;
- and
- sawing between the devices to form a plurality of packaged devices.
Dependencies are inferred from the claim text.