Packaging method of image sensing device
AssigneeImpac Technology Co., Ltd.
InventorsChi-Chih Huang, Chih-Yang Hsu
Life of this patent
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Abstract
A packaging method for an image sensing device is disclosed. The packaging method includes the steps of a) mounting an image sensing module, having a light-receiving region exposed, on a substrate; b) connecting the image sensing module and the substrate via a plurality of bonding wires; c) forming a protecting layer on the light-receiving region of the image sensing module; d) forming a molding layer to seal the plurality of bonding wires; e) flattening the protecting layer and the molding layer; f) removing the protecting layer to expose the light-receiving region of the image sensing module; and g) forming a transparent lid.
Claims23
A packaging method for an image sensing device, comprising the steps of:
- a) mounting an image sensing module, having a light-receiving region exposed, on a substrate;
- b) connecting said image sensing module and said substrate via a plurality of bonding wires;
- c) forming a protecting layer on said light-receiving region of said image sensing module;
- d) forming a molding layer to seal said plurality of bonding wires;
- e) flattening said protecting layer and said molding layer;
- f) removing said protecting layer to expose said light-receiving region of said image sensing module;
- and
- g) forming a transparent lid.
A packaging method for an image sensing device, comprising the steps of:
- a) providing an image sensing module having a light-receiving region;
- b) forming a protecting layer on said light-receiving region of said image sensing module;
- c) forming a molding layer around said protecting layer without covering said protecting layer;
- d) flattening said protecting layer and said molding layer;
- e) removing said protecting layer to expose said light-receiving region of said image sensing module;
- and
- f) forming a transparent lid.
Dependencies are inferred from the claim text.