Resist composition and patterning process
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsTakanobu Takeda, Akinobu Tanaka
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Abstract
In a chemically amplified resist composition comprising a base resin, an acid generator, and a solvent, 1400-5000 pbw of the solvent is present per 100 pbw of the resin. The solvent comprises a major proportion of PGMEA, 10-40 wt % of ethyl lactate, a total of PGMEA and ethyl lactate being at least 60 wt %, and 0.2-20 wt % of a high-boiling solvent.
Claims8
A chemically amplified resist composition comprising a base resin, an acid generator, and a solvent, wherein a resist film of the composition changes its solubility in a developer under the action of an acid generated by the acid generator upon exposure to high-energy radiation, wherein
- the composition contains the solvent in a total amount of 1,400 to 5,000 parts by weight per 100 parts by weight of the base resin,
- the solvent comprises propylene glycol monomethyl ether acetate (PGMEA) and ethyl lactate which are present in a total amount of at least 60% by weight of the total solvent weight, a weight proportion of PGMEA relative to the total solvent weight is higher than a weight proportion of any other solvent relative to the total solvent weight, a weight proportion of ethyl lactate is 10% to 40% by weight of the total solvent weight,
- the solvent further comprises at least one solvent selected from the group consisting of γ-butyrolactone, alkyl acetoacetate, dipropylene glycol methyl ether acetate, dipropylene glycol butyl ether, tripropylene glycol butyl ether, ethylene carbonate, and propylene carbonate, in a proportion of 0.2% to 20% by weight of the total solvent weight.
Dependencies are inferred from the claim text.