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US 2009/0214875 A1Published application
Laminating adhesive for demoulding at elevated temperature
AssigneeSika Technology AG
InventorKai Paschkowski
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Abstract
The present invention relates to a laminating adhesive composition which contains a reaction product which contains isocyanate groups and which is obtained from the reaction of at least two specific polyester polyols, solid at room temperature, and a polyisocyanate. Particularly in the case of three-dimensionally deformed support material surfaces, the laminating adhesive compositions permit removal from the laminating mould at an elevated temperature.
Claims18
Laminating adhesive composition comprising a reaction product which contains isocyanate groups and is obtained from the reaction of
- a) at least one crystalline polyester polyol P1 which is solid at room temperature and has a molecular weight of between 1500 and 9000 g/mol and a softening point of more than 100° C.;
- and
- b) at least one polyester polyol P2 which is solid at room temperature and has a molecular weight of 10 000 to 50 000 g/mol and a softening point of more than 130° C.;
- c) if desired at least one polyol P3;
- with
- d) at least one polyisocyanate P, the polyisocyanate P being used in a stoichiometric excess in relation to the polyols P1 and P2 and P3.
3 more elements
Dependencies are inferred from the claim text.