System and method for inspecting chips in a tray and tray handling apparatus thereof

A tray handling apparatus, comprising:

• a tray guide mechanism comprising a plurality of guides erected on a horizontal surface, wherein the guides define a space configured to accommodate stacked trays;
• and
• a chuck device comprising a chuck and configured to move the stacked trays vertically, wherein the chuck is disposed at a center position of a bottom area of the space;
• wherein the guides move symmetrically relative to the chuck so that the space is enlarged or reduced symmetrically.

A method for inspecting chips in a tray, comprising the steps of:

• moving a tray from a first tray handling apparatus to a first place where a three-dimensional sensor performs measurement;
• measuring height information of each chip in the tray by the three-dimensional sensor;
• moving the tray to a second place where an image sensor performs an inspection;
• inspecting a surface of each chip;
• moving each defective chip to a tray for receiving defective chips located on an unqualified area, then moving the tray to a second tray handling apparatus;
• and
• moving the tray to a third tray handling apparatus after each defective chip is removed from the tray;
• wherein the first tray handling apparatus and/or the second tray handling apparatus comprise a tray guide mechanism that includes a plurality of guides;
• the guides define a space having a central axis parallel to the guides;
• and the guides move symmetrically relative to the central axis so that the space is enlarged or reduced symmetrically.