Miniature Microphone Assembly With Solder Sealing Ring
AssigneePulse MEMS ApS
InventorsLeif Steen Johansen, Per F. Høvesten, Gino Rocca
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Abstract
The present invention relates to a miniature microphone assembly comprising a capacitive microphone transducer comprising a microphone electrical contact or terminal, a microphone carrier comprising a carrier electrical contact or terminal formed on a first surface thereof, and an integrated circuit die comprising a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a first electrically conductive path surrounding the carrier electrical contact or terminal.
Claims18
A miniature microphone assembly, comprising:
- a capacitive microphone transducer comprising a microphone electrical contact or terminal;
- a microphone carrier comprising a carrier electrical terminal formed on a first surface thereof;
- and
- an integrated circuit die having a first surface comprising a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die, and
- wherein a first electrically conductive path is disposed on the first surface of the integrated circuit die, said first electrically conductive path forming a substantially closed loop surrounding the die electrical terminal.
A miniature microphone assembly according to any of the preceding claims, wherein the capacitive microphone transducer comprises a condenser element or electret element such as a microelectromechanical (MEMS) condenser element.
A miniature microphone assembly according to any of the preceding claims, wherein the microphone carrier comprises substrate material selected from the group of a printed circuit board, ceramics, and silicon.
A miniature microphone assembly according to any of the preceding claims, wherein a capacitance of the capacitive microphone transducer is less than 20 pF, such as less than 10 pF or less than 5 pF, such as less than 2 pF.
A miniature microphone assembly according to any of the preceding claims, wherein the capacitive microphone transducer comprises diaphragm and back-plate members and first and second electrical contacts or terminals electrically coupled to the diaphragm and back-plate members, respectively.
A miniature microphone assembly according to any of the preceding claims, wherein the capacitive microphone transducer and integrated circuit die are attached to, and electrically connected to, the microphone carrier and electrically interconnected by electrical traces formed on the first surface or an underlying layer of the microphone carrier.
A miniature microphone assembly according to any of the preceding claims, wherein the first surface of the integrated circuit die comprises a plurality of die electrical terminals and a peripherally arranged first electrically conductive path surrounding the plurality of die electrical terminals.
A miniature microphone assembly according to any of the preceding claims, wherein the microphone carrier comprises:
- a second and substantially plane surface arranged opposite to the first surface, and
- the second surface comprising a plurality of electrical contacts to allow surface mounting attachment of the condenser microphone assembly to an external circuit board.
A portable communication device comprising a miniature microphone assembly according to any of the preceding claims, said portable communication device being selected from the group consisting of mobile phones, head-sets, in-ear monitors, hearing prostheses or hearing aids, game consoles, and portable computers, and any combination thereof.
Dependencies are inferred from the claim text.