Microsystem component with a device deformable under the effect of temperature changes
AssigneeUniversitaet Kassel
InventorsIvo Rangelow, Tzvetan Ivanov, Katerina Ivanova
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Abstract
A microsystem component with a device (3) deformable under the influence of temperature changes is disclosed. The device comprises at least one first (4, 5) and second (8) element with differing thermal expansion coefficients and different thermal conductivities. The elements (4, 5; 8) are physically separate and arranged and connected to each other such that the device (3) assumes flexure states which are dependent on the temperature.
Claims25
Microsystem component with a device (3, 3a, 45), which is deformable under the effect of temperature changes and contains at least one first bendable element (4, 4a, 46) and at least one second bendable element (8, 8a, 8b, 47), wherein these elements (4, 4a, 46;
- 8, 8a, 8b, 47) are arranged spatially separated from one another, have different coefficients of thermal expansion and different heat conductivities, and are arranged and connected to one another in such a manner that the device (3, 3a, 45) assumes a bending state that is dependent on the temperature.
Dependencies are inferred from the claim text.