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AssigneeThomson Licensing
InventorsJulian Thevenard, Dominique LO Hine Tong, Ali Louzir, Corinne Nicolas, Christian Person, Jean-Philippe Coupez
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The present invention relates to an interconnection system of a first substrate (1) comprising at least one first transmission line (3) with a second substrate (10) comprising at least one second transmission line (11), the orientation of the first substrate with respect to the second substrate being arbitrary. The first substrate (1) comprises at least one metallized hole at one extremity of said first line and the second substrate (10) comprises a projecting element extending said second line and a ground saving, said projecting element being inserted into the metallized hole. The invention notably applies in the domain of microwaves and can interconnect a substrate comprising a printed antenna with a substrate receiving the processing circuits of the signal.
1- An interconnection system of a first substrate comprising at least one first transmission line with a second substrate comprising at least one second transmission line, the orientation of the first substrate with respect to the second substrate being arbitrary, the first substrate comprising at least a metallized hole at an extremity of said first line and the second substrate comprising a projecting element extending from said second line and a ground saving, said projecting element being inserted into the metallized hole.
2- The system of claim 1, wherein the hole is surrounded, on the two faces of the first substrate, by a non-metallized saving.
3- The system of claim 2, wherein the saving formed between the metallized hole and a ground plane of the first substrate, associated with the transmission line part crossing the saving together with the transmission line located on the second substrate and its opposite ground saving, forms a filtering element.
4- The system of claim 3, wherein the filtering element is constituted by two self-inductance elements in series and a parallel resonating element, presenting a low-pass type response with a transmission zero.
5- The system of claim 4, wherein the value of the resonating element is a function of the dimension of the saving between the metallized hole and the ground plane of the first substrate.
6- The system of claim 4, wherein the value of the self-inductance element of the first substrate is a function of the length of the transmission line above the saving.
7- The system of claim 4, characterized in that the value of the self-inductance element of the second substrate is a function of the length of the transmission line above the saving.
8- The system of claim 1, wherein the transmission line of the first substrate extends beyond the metallized hole by a line element.
9- The system of claim 1, wherein the part of the projecting element of the second substrate is non-metallized on the opposite face to the face receiving the second feed line.
10- The system of claim 1, wherein the first and second feed lines are microstrip lines, coplanar lines, tri-plate lines.
11- The system of claim 1, wherein the first and second substrates are single-layer or multi-layer substrates.