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US 2009/0213553 A1Published application
Power Module
AssigneeInfineon Technologies AG
InventorsRoman Tschirbs, Reinhold Spanke
Life of this patent
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Abstract
A power semiconductor module comprises a housing. The housing comprises a casing and at least one coating of high resistance to surface tracking. A plurality of electrical conductors is provided on the housing. The coating is provided on a creepage distance that is provided between the electrical conductors.
Claims24
A power semiconductor module comprising a housing wherein the housing comprises:
- a casing and at least one coating of high resistance to surface tracking;
- and
- a plurality of electrical conductors being provided on the housing, the coating being provided on a creepage distance between the electrical conductors.
A method for producing a power semiconductor module, comprising:
- providing a housing;
- providing a plurality of electrical conductors on the housing;
- providing at least one coating of high resistance to surface tracking on a creepage distance between the electrical conductors.
A method for producing a power semiconductor module, comprising:
- providing a housing;
- providing a plurality of electrical conductors on the housing;
- and
- partly covering the housing with a coating susceptible to surface tracking on a creepage distance between the electrical conductors.
1 more element
Dependencies are inferred from the claim text.