Component arragement with an optimized assembly capability

A component arrangement comprising:

• an electronics module;
• a heat sink contacting the electronics module;
• a printed circuit board;
• and
• a fastener fastening the electronics module to the printed circuit board and the heat sink;
• wherein the electronics module comprises,
• at least one elastic lead providing a solder-free contact between the electronics module and the printed circuit board;
• a receptacle receiving the fastener, and
• a decoupler decoupling a compressive force between the lead and the printed circuit board from a pressing force between the heat sink and the electronics module.

An electronics module configured for electrical contacted with a printed circuit board and thermal contact with a heat sink, the electronics module, printed circuit board and heat sink fastened by a fastener, the electronics module comprising:

• at least one elastic lead configured to provide a solder-free contact between the electronics module and the printed circuit board;
• a receptacle configured to receive the fastener;
• and
• a decoupler configured to decouple a compressive force between the at least one elastic lead and the printed circuit board from a pressing force between the heat sink and the electronics module.

An electrical component arrangement comprising:

• a heat sink;
• an electronics module in thermal contact with the heat sink, the electronics module including a package, at least one lead extending from the package, a receptacle formed in the package, and a spacer extending from the package;
• a printed circuit board in electrical contact with the electronics module through a solder-free contact with the at least one lead, the printed circuit board separated from the package of the electronics module by the spacer;
• and
• a fastener positioned in the receptacle of the electronics module, the fastener fastening the electronics module to the printed circuit board and the heat sink.

A component arrangement comprising:

• an electronics module;
• a heat sink in contact with the electronics module;
• a printed circuit board;
• and
• means for fastening the electronics module with the printed circuit board and the heat sink;
• wherein the electronics module comprises,
• an elastic lead configured to provide a solder-free contact of the electronics module with the printed circuit board,
• a receptacle configured to receive the means for fastening, and
• means for decoupling a compressive force between the lead and the printed circuit board from a pressing force between the heat sink and the electronics module.