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OwnerMatthew Allen Butterbaugh, Maurice Francis Holahan +2inventors
InventorsMatthew Allen Butterbaugh, Maurice Francis Holahan, Terry L. Lyon, David Roy Motschman
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A cooling plate assembly for transferring heat from electronic components mounted on a circuit board includes both fixed and articulated interfaces. A fixed-gap coldplate is positioned over and in thermal contact with (e.g., through an elastomerically compressive pad thermal interface material) electronic components mounted on the circuit board's top surface. An articulated coldplate is positioned over and in thermal contact with at least one electronic component mounted on the circuit board's top surface. In the preferred embodiments, the articulated coldplate is spring-loaded against one or more high power processor components having power dissipation greater than that of the electronic components under the fixed-gap cooling plate. Thermal dissipation channels in the coldplates are interconnected by flexible tubing, such as copper tubing with a free-expansion loop. In the preferred embodiments, the coldplates and the flexible tubing are connected to define a portion of a single flow loop used to circulate cooling fluid through the coldplates.
A cooling plate assembly for transferring heat from a plurality of electronic components mounted on a circuit board, comprising:
A cooling plate assembly for transferring heat from a plurality of electronic components mounted on a circuit board, comprising:
A method of attaching a heat transfer assembly to a circuit board for transferring heat from a plurality of electronic components mounted on the circuit board, comprising the steps of:
A method of transferring heat from a plurality of electronic components mounted on a circuit board, comprising the steps of:
Dependencies are inferred from the claim text.