Heat disssipation assembly for computing devices
AssigneeH Christian Gunderson
InventorAlan Mark Cohen
Life of this patent
Estimating the term…
Abstract
An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat sink is included which is in thermal contact with the microprocessor whereby a water barrier is applied to and proximate the socket for preventing water of condensation from contacting areas covered by the water barrier and a moisture absorbent surrounding the heat sink.
Claims28
(canceled)
The assembly of claim 22 wherein said water barrier comprises a layer of dielectric grease.
The assembly of claim 22 wherein said water barrier comprises a low viscosity liquid sprayed over and in proximity to said socket.
The assembly of claim 22 wherein said water barrier comprises a liquid in which said motherboard can be dipped.
The assembly of claim 22 wherein said microprocessor comprises a CPU in the form of a die appended to a support, said support being in electrical contact with said socket.
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
An assembly for use in a computing device comprising a microprocessor and a mother board that includes a socket for receiving and making electric contact with said microprocessor, said assembly further comprising a casing surrounding at least a portion of said microprocessor, said casing having an inlet and outlet for circulating a coolant proximate said microprocessor.
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
An assembly for use in a computing device comprising a microprocessor and a mother board that includes a socket for receiving and making electric contact with said microprocessor, said assembly further comprising a casing surrounding at least a portion of said microprocessor, said casing having an inlet and outlet for circulating a coolant proximate said microprocessor and wherein a water barrier is applied to and proximate said socket for preventing water condensation from contacting areas covered by said barrier.
Dependencies are inferred from the claim text.