Support structures for electromechanical systems and methods of fabricating the same
AssigneeIdc, LLC
InventorJeffrey B. Sampsell
Life of this patent
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Abstract
A method of making an interferometric modulator element includes forming at least two posts, such as posts formed from spin-on glass, on a substrate. In alternate embodiments, the posts may be formed after certain layers of the modulator elements have been deposited on the substrate. An interferometric modulator element includes at least two spin-on glass support posts located on the substrate. In alternate embodiments, the support posts may be located over certain layers of the modulator element, rather than on the substrate. A method of making an interferometric modulator element includes forming a rigid cap over a support post. An interferometric modulator element includes support posts having rigid cap members.
Claims21
A method of fabricating an electromechanical device, the method comprising:
- forming an optical stack over a substrate;
- forming a sacrificial layer over the optical stack;
- A
- patterning the sacrificial layer to form holes;
- forming a support structure located at least partially within said holes in the sacrificial layer, wherein forming a support structure comprises
- depositing a first layer over the sacrificial layer,
- depositing a second layer over the conformal layer, wherein the second layer comprises a different material than the first layer, and
- patterning said first layer and said second layer to form a support structure;
- and
- forming a flexible layer over the support structure, wherein the flexible layer is supported by the support structure.
An electromechanical device, comprising:
- an optical stack located over a substrate;
- a flexible layer spaced apart from the optical stack by a gap;
- and
- a support structure located between the optical stack and the flexible layer, wherein the support structure comprises
- a first layer comprising a material more rigid than the flexible layer, and
- a second layer overlying the first layer.
A method of fabricating an electromechanical device, the method comprising:
- forming an optical stack over a substrate;
- forming a sacrificial layer over the optical stack;
- forming support structures located over the substrate;
- forming a flexible layer over the sacrificial layer, wherein the flexible layer is supported by the support structures;
- and
- forming at least one overlying support structure over a portion of the flexible layer, wherein at least a portion of the at least one overlying support structure is located over a support structure.
An electromechanical device, comprising:
- an optical stack located over a substrate;
- support structures located over the substrate;
- a flexible layer spaced apart from the optical stack by a cavity, wherein the flexible layer is supported by the support structures;
- and
- at least one overlying support structure over a portion of the flexible layer, wherein at least a portion of the at least one overlying support structure is located over a support structure.
Dependencies are inferred from the claim text.