Attachment of wafer level optics
AssigneeFlextronics AP, LLC
InventorsHarpuneet Singh, Irmina Carpio, Guan Hock Yeow
Life of this patent
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Abstract
A technique for assembling camera modules that includes attaching optical elements, such as an optics stack, directly to the upper surface of an image sensor. A housing may be provided to partially surrounded the optics stack. Alternatively, the housing can be provided by a transfer molding process. This technique can be applied in array processing scenario and solder balls can be attached to the bottom of the image sensor to provide an efficiently-produced and low cost camera module.
Claims16
A camera module assembly, comprising:
- a substrate;
- an image sensor coupled to the substrate;
- and
- an optics stack attached directly to the image sensor.
A camera module assembly, comprising:
- an image sensor;
- and
- an optics stack attached directly to a top surface of the image sensor.
A method for producing camera modules, comprising:
- providing a wafer including a plurality of image sensors;
- coupling an optics stack directly to each of the image sensors;
- partially encapsulating the optics stack with transfer molding, leaving an opening through the transfer molding to allow light to pass therethrough;
- and
- singulating the assembly into separate camera modules.
A method for producing camera modules, comprising:
- providing a substrate having an image sensor;
- and
- coupling an optics stack directly to the image sensor.
Dependencies are inferred from the claim text.