Method of manufacturing of a liquid jet head, a method of manufacturing of a piezoelectric element and a liquid jet apparatus
AssigneeSeiko Epson Corporation
InventorXin-shan Li
Life of this patent
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Abstract
In a step of heating a piezoelectric precursor film, piezoelectric films are formed one by one on each of plurality of flow passage forming substrate wafers constituting a flow passage forming substrate wafer group, and an order of the flow passage forming substrate wafers for starting the heating of the piezoelectric precursor film is varied by the predetermined number of wafers of the flow passage forming substrate wafer group.
Claims9
A method of manufacturing a liquid jet head, comprising the steps of:
- forming a lower electrode on one surface of a flow passage forming substrate wafer in which a plurality of flow passage forming substrates each provided with pressure generating chambers individually communicating with nozzle openings for ejecting a liquid are integrally formed;
- forming a piezoelectric layer, in which a plurality of piezoelectric films are laminated by repeatedly performing a step of forming a piezoelectric precursor film to be turned into the piezoelectric film and a step of forming a piezoelectric film has a step of placing the flow passage forming substrate wafer within a heating chamber and a step of heating the piezoelectric precursor film to form the piezoelectric film, on the lower electrode side of the flow passage forming substrate wafer;
- and
- forming an upper electrode on the piezoelectric layer,
- wherein in the step of heating the piezoelectric precursor film, the piezoelectric films are formed one by one on each of the plurality of flow passage forming substrate wafers constituting a flow passage forming substrate wafer group, and an order of the flow passage forming substrate wafers for starting the heating of each piezoelectric precursor film is varied by the predetermined number of wafers of the flow passage forming substrate wafer group.
A method of manufacturing a liquid jet head, comprising the steps of:
- forming a lower electrode on one surface of a flow passage forming substrate wafer in which a plurality of flow passage forming substrates each provided with pressure generating chambers individually communicating with nozzle openings for ejecting a liquid are integrally formed;
- forming a piezoelectric layer, in which a plurality of piezoelectric films are laminated by repeatedly performing a step of forming a piezoelectric precursor film to be turned into the piezoelectric film and a step of forming a piezoelectric film has a step of placing the flow passage forming substrate wafer within a heating chamber and a step of heating the piezoelectric precursor film to form the piezoelectric film, on the lower electrode side of the flow passage forming substrate wafer;
- and
- forming an upper electrode on the piezoelectric layer,
- wherein in the step of laminating the piezoelectric films, the flow passage forming substrate wafer is rotated at a predetermined angle in an in-plane direction of the flow passage forming substrate wafer to be arranged within the heating chamber in the heating of each piezoelectric precursor film.
A method of manufacturing a piezoelectric element, comprising the steps of:
- forming a lower electrode on a substrate;
- forming a piezoelectric layer, in which a plurality of piezoelectric films are laminated by repeatedly performing a step of forming a piezoelectric precursor film to be turned into the piezoelectric film and a step of forming a piezoelectric film has a step of placing the substrate within a heating chamber and a step of heating the piezoelectric precursor film to form the piezoelectric film, on the lower electrode of the substrate;
- and
- forming an upper electrode on the piezoelectric layer,
- wherein in the step of heating the piezoelectric precursor film, the piezoelectric films are formed one by one on each of the plurality of substrates constituting a substrate group, and an order of the substrates for starting the heating of each piezoelectric precursor film is varied by the predetermined number of substrates of the substrate group.
Dependencies are inferred from the claim text.