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US 2009/0213017 A1Published application
Housing, wireless communication device using the housing, and manufacturing method thereof
AssigneesShenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
InventorsFu-Keng Yang, Bing Zhang, Yi-Ping Zeng, Jian-Jun Zhan
Life of this patent
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Abstract
A housing for a wireless communication device includes a substrate and an antenna pattern formed on the substrate. The antenna pattern is an electrically conductive coating of conductive ink. A method for making the housing and a wireless communication device using the housing is also disclosed.
Claims16
A housing for a wireless communication device, comprising:
- a substrate;
- and
- an antenna circuit pattern disposed on the substrate;
- wherein the antenna circuit pattern is an electrically conductive coating of conductive ink.
1 more element
A wireless communication device, comprising:
- a main body comprising a printed circuit board therein, the printed circuit board comprising a conductive pole mounted thereon configured for sending and/or receiving electromagnetic waves;
- and
- a housing mounted on the main body, comprising:
- a substrate;
- and
- an antenna circuit pattern disposed on the substrate;
- wherein the antenna circuit pattern is an electrically conductive coating of conductive ink.
4 more elements
A method for manufacturing a housing for a wireless communication, comprising:
- providing a substrate;
- and
- printing a conductive ink coating on the substrate to form an antenna pattern.
Dependencies are inferred from the claim text.