Multi-planar solid state amplifier
AssigneeViaSat, Inc.
InventorNoel Lopez
Life of this patent
Estimating the term…
Abstract
A solid state power amplifier (SSPA) system may include a radio frequency (RF) input, an RF waveguide split block, multiple monolithic microwave integrated circuit (MMIC) power amplifier modules, and/or a heat spreader. The power amplifier modules and RF waveguide may be distributed about the heat spreader in different planes. Furthermore, the power amplifier modules may be located on opposite sides of the heat spreader and nonplanar to the waveguide split block. A method for dissipating heat within an SSPA may include receiving an RF signal in a first plane, amplifying the RF signal in another plane, and combining the RF signal in yet another plane.
Claims22
A solid state amplifier system comprising:
- an radio frequency (RF) waveguide split block including an RF waveguide splitter and an RF waveguide combiner, wherein the RF waveguide splitter is in communication with an RF input;
- a first monolithic microwave integrated circuit (MMIC) arranged in a first plane and a second MMIC arranged in a second plane, wherein the first plane is not coplanar with the second plane, and wherein the first MMIC and the second MMIC are placed in communication with the RF waveguide split block;
- and
- a heat spreader having a first surface and a second surface, wherein the first surface is in thermal communication with the first MMIC, wherein the second surface is in thermal communication with the second MMIC, and wherein the first surface is in a different plane than the second surface.
A solid state amplifier comprising:
- a heat spreader having first, second, third, and fourth surfaces along different planes;
- a first monolithic microwave integrated circuit (MMIC) in thermal communication with the second surface of the heat spreader;
- and
- a second MMIC in thermal communication with the third surface of the heat spreader;
- wherein the first MMIC is part of a first power amplifier module that is in contact with said second surface of the heat spreader, and wherein the second MMIC is part of a second power amplifier module that is in contact with the third surface of the heat spreader.
A method for amplifying a radio frequency (RF) signal within a solid state amplifier, the method comprising:
- receiving an RF signal;
- splitting the RF signal into multiple RF signals and outputting a first set of the multiple RF signals for use in a first plane and outputting a second set of the multiple RF signals for use in a second plane;
- amplifying the first set of the multiple RF signals with a first amplifier component located in the first plane and amplifying the second set of the multiple RF signals with a second amplifier component located in the second plane, and
- combining the first and second sets of the multiple RF signals in a different plane than the plane used for splitting the RF signal.
A three dimensional solid state amplifier comprising:
- a waveguide splitter in a first plane;
- a waveguide combiner in a second plane;
- and
- a first amplifier component in a third plane and a second amplifier component in a fourth plane, wherein each of the first and second amplifier components individually comprise active components configured to amplify a radio frequency (RF) signal;
- wherein the waveguide splitter is connected in communication with inputs of the first and second amplifier components;
- wherein the waveguide combiner is connected in communication with outputs of the first and second amplifier components;
- wherein the first, second, third, and fourth planes are not co-planar;
- and
- wherein the first and second planes are not parallel to either of the third and fourth planes.
A three dimensional solid state amplifier comprising:
- a radio frequency (RF) signal splitter in a first plane;
- an RF signal combiner in a second plane;
- and
- a first amplifier component in a third plane and a second amplifier component in a fourth plane, wherein each of said first and second amplifier components comprises active components configured to amplify an RF signal;
- wherein the RF signal splitter is connected in communication with the first and second amplifier components;
- wherein the RF signal combiner is connected in communication with the first and second amplifier components;
- and
- wherein the first, second, third, and fourth planes are arranged about a central axis, and parallel to the central axis.
A power amplifier comprising:
- a first power amplifier module in a first plane;
- a second power amplifier module in a second plane;
- and
- a signal splitter in a third plane, wherein an RF signal is communicated from the signal splitter to the first and second power amplifiers, and wherein the RF signal is communicated from the first and second power amplifiers to a signal combiner in a fourth plane.
Dependencies are inferred from the claim text.