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US 2009/0212812 A1Published application
Multi-chip package semiconductor device and method of detecting a failure thereof
AssigneeSamsung Electronics Co., Ltd.
InventorSang-Jib Han
Life of this patent
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Abstract
A semiconductor chip may include at least one power supply pad for receiving an external power voltage, at least one input/output pad, an internal function block that may be configured to operate based on a power voltage to at least one of receive and transmit a signal through the input/output pad, and a mode set circuit that may enable or disable the power voltage by a mode set signal in an individual chip test mode.
Claims3
A method of detecting a failure in semiconductor chips of a multi-chip package semiconductor device, the method comprising:
- commonly providing a power to the semiconductor chips of the multi-chip package semiconductor device through a power supply terminal;
- setting one of the semiconductor chips to a disabled state and the rest of the semiconductor chips to an enabled state based on a test mode set signal;
- measuring a current flowing through the power supply terminal commonly coupled to the semiconductor chips;
- and
- determining a failure of the disabled semiconductor chip by comparing the measured current and a normal current corresponding to a normal operation state.
2 more elements
Dependencies are inferred from the claim text.