Method of making high-frequency probe, probe card using the high-frequency probe
AssigneeMpi Corporation
InventorsWei-Cheng Ku, Kuan-Chun Chou
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Abstract
A high frequency probe preparation method for making a high frequency probe for high frequency testing to assure signal integrity by means of making a sleeve assembly subject to the size of a predetermined bare needle and then sleeving bare needle by the sleeve assembly to form a high-frequency probe is disclosed to include the steps of: a) providing an insulated tube, and b) forming a conducting layer on the outer surface of the insulated tube which having a metal layer for grounding. The insulated tube and the conducting layer constitute the sleeve assembly. The metal layer is formed by means of physical deposition, chemical deposition, mixture of physical and chemical deposition or electrochemical deposition.
Claims15
A high-frequency probe preparation method for making a high frequency probe by means of making a sleeve assembly subject to the size of a predetermined bare needle and then sleeving said bare needle by the sleeve assembly to form a high-frequency probe, the high frequency probe preparation method comprising the steps of:
- a) providing an insulated tube;
- and
- b) forming a conducting layer on the outer surface of said insulated tube, said conducting layer comprising at least one metal layer for electrically grounded, said metal layer having a thickness within 0.01 μm˜10 μm, said insulated tube and said conducting layer constituting said sleeve assembly;
- wherein said metal layer is formed by means of one of the methods of physical deposition, chemical deposition, mixture of physical and chemical deposition, and electrochemical deposition.
Dependencies are inferred from the claim text.