Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device

A probe card comprising:

• a probe sheet including a plurality of contact terminals to be in contact with electrodes provided on an object to be inspected, wirings electrically led out from the plurality of contact terminals, and a plurality of first and second peripheral electrodes electrically connected to the wirings and connected to electrodes of a multi-layer wiring board,
• wherein a fixing substrate is fixed to a region having the plurality of contact terminals formed therein at a second surface of the probe sheet on a side reverse to a first surface of the probe sheet on which the plurality of contact terminals are formed,
• means for allowing the fixing substrate to be inclinable is provided,
• each of the plurality of contact terminals is formed at one end of a beam which extends so as to be spaced away from the probe sheet and is electrically connected to the wiring,
• the other end of the beam is fixed to the probe sheet,
• each of the plurality of first peripheral electrodes is formed on the first surface of the probe sheet on a same side as the contact terminals, and
• each of the plurality of second peripheral electrodes is formed on the second surface of the probe sheet on a side reverse to the contact terminals.

A semiconductor inspection apparatus comprising:

• a sample stage on which an object to be inspected is placed;
• and
• a probe card which includes a plurality of contact terminals to be in contact with electrodes provided on the object to be inspected and is electrically connected to a tester which inspects electrical characteristics of the object to be inspected,
• wherein the probe card has a probe sheet including the plurality of contact terminals, wirings electrically led out from the plurality of contact terminals, and a plurality of peripheral electrodes electrically connected to the wirings and connected to electrodes of a multi-layer wiring board,
• a fixing substrate is fixed to a region having the plurality of contact terminals formed therein at a second surface of the probe sheet on a side reverse to a first surface of the probe sheet on which the plurality of contact terminals are formed,
• means for allowing the fixing substrate to be inclinable is provided,
• each of the plurality of contact terminals is formed at one end of a beam which extends so as to be spaced away from the probe sheet and is electrically connected to the wiring, and
• the other end of the beam is fixed to the probe sheet.