Semiconductor Device
AssigneeInfineon Technologies AG
InventorsChai Wei Heng, Wae Chet Yong, Stanley Job Doraisamy, Khai Huat Jeffrey Low, Gerhard Deml
Life of this patent
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Abstract
A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
Claims26
A semiconductor device comprising:
- a die pad;
- a die on the die pad;
- and
- resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone, with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
A method of packaging a semiconductor device, the method comprising:
- providing a mold including a warpage compensation portion;
- providing a die and a leadframe;
- and
- encapsulating the die and the leadframe including forming a mounting aperture and an isolation thickness on a die pad.
A method of mounting a semiconductor device, the method comprising:
- providing a semiconductor device including a die, a die pad, a mounting aperture, an isolation thickness on the die pad and a major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone, with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion;
- providing a mounting medium between the semiconductor device and a heat sink;
- and
- mounting the semiconductor device to the heat sink.
A semiconductor device comprising:
- a die pad;
- a die on the die pad;
- and
- resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion adjacent to the mounting aperture, with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion.
Dependencies are inferred from the claim text.