Semiconductor package and method of manufacturing the same

A method of manufacturing a semiconductor package, comprising:

• providing a substrate, the substrate having a first surface, a second surface opposite thereto, and a through hole penetrating the first surface and the second surface, wherein a circuit pattern structure is disposed on the substrate, and the circuit pattern structure has at least one connecting pad disposed at the through hole;
• fastening a chip on the first surface of the substrate by an adhesive, wherein the chip has at least one conductive post, and the conductive post is disposed inside the through hole;
• curing the adhesive;
• and
• filling at least one conductive material into the through hole, wherein the conductive post is electrically connected with the pattern circuit structure through the conductive material and the connecting pad.

A semiconductor package, comprising:

• a substrate having a first surface, a second surface opposite thereto, and a through hole penetrating the first surface and the second surface;
• a circuit pattern structure disposed on the second surface and having at least one connecting pad disposed corresponding to the through hole;
• a chip disposed on the first surface of the substrate and having at least one conductive post, wherein the conductive post is disposed inside the through hole, and a height of the conductive post is larger than a thickness of the substrate;
• and
• at least one conductive material disposed inside the through hole, wherein the conductive post is electrically connected with the pattern circuit structure through the conductive material and the connecting pad, and the conductive material is in contact with the chip.

A semiconductor package, comprising:

• a substrate having a first surface, a second surface opposite thereto, and a through hole penetrating the first surface and the second surface;
• a circuit pattern structure disposed on the second surface and having at least one connecting pad disposed corresponding to the through hole;
• a chip disposed on the first surface of the substrate and having at least one conductive post, wherein the conductive post is disposed inside the through hole;
• at least one conductive material disposed inside the through hole, wherein the conductive post is electrically connected with the pattern circuit structure through the conductive material and the connecting pad;
• and
• an adhesive disposed inside the through hole.