Integrated circuit package substrate having configurable bond pads

A method for assembling a flip chip integrated circuit package, comprising:

• forming a first electrically conductive feature and a second electrically conductive feature on a first surface of a substrate, wherein the first electrically conductive feature is a portion of a first electrical signal net of the substrate, and the second electrically conductive feature is a portion of a second electrical signal net of the substrate, and wherein first and second electrically conductive features are electrically isolated from each other;
• and
• applying a solder mask layer over at least a portion of the first surface of the substrate;
• wherein said forming step includes configuring the first and second electrically conductive features to be selectively electrically coupled together by application of an electrically conductive material.

A substrate for a flip chip integrated circuit package, comprising:

• a substrate body having opposing first and second surfaces;
• a solder mask layer that covers at least a portion of the first surface of the substrate body;
• a first electrically conductive feature on the first surface of the substrate body;
• a second electrically conductive feature on the first surface of the substrate body that is proximate to the first electrically conductive feature;
• and
• a mounting region for a flip chip oriented integrated circuit die on the first surface of the substrate body;
• wherein the first electrically conductive feature is a portion of a first electrical signal net of the substrate, and the second electrically conductive feature is a portion of a second electrical signal net of the substrate;
• and
• wherein the first and second electrically conductive features are configured to be selectively electrically coupled together by application of an electrically conductive material.