Integrated circuit package system with penetrable film adhesive
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Guan Chow, Linda Pei Ee Chua, Heap Hoe Kuan
Life of this patent
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Abstract
An integrated circuit package system including: providing a wire bonded die with an active side and a bond wire connected thereto; forming a penetrable film adhesive on the active side and partially encapsulating the bond wire; mounting an interposer, having a first functional side facing up away from the wire bonded die and a second functional side facing down toward the wire bonded die and having exposed conductors, over the wire bonded die; providing a substrate and connecting the first functional side by the exposed conductor with an electrical interconnect to the substrate; and encapsulating the wire bonded die, and the penetrable film adhesive with an encapsulation.
Claims20
An integrated circuit package system comprising:
- providing a wire bonded die with an active side and a bond wire connected thereto;
- forming a penetrable film adhesive on the active side;
- mounting an interposer over the wire bonded die, having a first functional side facing up away from the wire bonded die and a second functional side facing down toward the wire bonded die and having exposed conductors;
- providing a substrate and connecting the first functional side by the exposed conductor with an electrical interconnect to the substrate;
- and
- encapsulating the wire bonded die, and the penetrable film adhesive with an encapsulation.
An integrated circuit package system comprising:
- providing a wire bonded die with an active side and a bond wire connected thereto;
- forming a penetrable film adhesive on the active side;
- mounting a structure, an interposer, or a combination thereof, which is the same size or larger than the wire bonded die, opposite the active side and which always includes mounting the interposer, having a first functional side facing up away from the wire bonded die and a second functional side facing down toward the wire bonded die and having exposed conductors;
- providing a substrate and connecting the first functional side by an exposed conductor with an electrical interconnect to the substrate;
- and
- encapsulating the wire bonded die, and the penetrable film adhesive with an encapsulation.
An integrated circuit package system comprising:
- a wire bonded die with an active side and a bond wire connected thereto;
- a penetrable film adhesive formed on the active side;
- an interposer mounted over the wire bonded die, having a first functional side facing up away from the wire bonded die and a second functional side facing down toward the wire bonded die and having exposed conductors;
- a substrate connected to the first functional side by the exposed conductor with an electrical interconnect to the substrate;
- and
- an encapsulation encapsulating the wire bonded die, and the penetrable film adhesive.
Dependencies are inferred from the claim text.