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US 2009/0212440 A1Published application
Semiconductor device
AssigneeNEC Electronics Corporation
InventorKohji Kanamori
Life of this patent
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Abstract
An object of the present invention is to solve the problem that the number of pads increases due to high packaging density and the size of semiconductor devices increases due to increase of the pad density. A semiconductor device according to the present invention uses a conductor trace on an interconnection substrate to interconnect two nonadjacent pads.
Claims10
A semiconductor device comprising:
- a semiconductor chip including a plurality of pads and a plurality of external connection terminals;
- and
- an interconnection substrate including an interconnection pattern connecting the plurality of pads to said external connection terminals;
- wherein a first pad among the plurality of pads and a second pad that is not adjacent to the first pad are interconnected by the interconnection pattern.
1 more element
A semiconductor device comprising:
- a semiconductor chip including a plurality of pads;
- and
- an interconnection substrate including an interconnection pattern connecting the semiconductor chip to an external connection terminal;
- wherein first pad of said pads, first branch of the interconnection pattern, the external connection terminal, second branch of the interconnection pattern, and second pad of said pads are disposed in this order between said first and said second pads.
1 more element
Dependencies are inferred from the claim text.