Semiconductor device

A semiconductor device comprising a semiconductor chip of a planer rectangular shape, wherein

• the semiconductor chip includes:
• a semiconductor substrate having a semiconductor element formed on a main surface thereof and patterned into the planer rectangular shape;
• a first insulator formed on the main surface of the semiconductor substrate;
• a first wire formed by filling an electric conductive film in a first trench portion formed in the first insulator;
• a second insulator formed on the first insulator and the first wire;
• and
• a third insulator formed on the second insulator so as to contact with the second insulator,
• the second insulator has a higher Young's modulus compared to the third insulator, and
• the second insulator is removed in a first region facing to a planer outer periphery of the semiconductor chip.

A semiconductor device comprising a semiconductor chip of a planer rectangular shape, wherein

• the semiconductor chip includes:
• a semiconductor substrate having a semiconductor element formed on a main surface thereof and patterned into the planer rectangular shape;
• a first insulator formed on the main surface of the semiconductor substrate;
• a first wire formed by filling an electric conductive film in a first trench portion formed in the first insulator;
• a second insulator formed on the first insulator and the first wire;
• and
• a third insulator formed on the second insulator so as to contact with the second insulator,
• the third insulator has a lower degree of adhesion to an upper-layer film or a lower-layer film compared to the second insulator, and
• the second insulator is removed in a first region facing to a planer outer periphery of the semiconductor chip.