Carbon nanotube-based conductive connections for integrated circuit devices
AssigneeKoninklijke Philips Electronics N.V.
InventorChristopher Wyland
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Abstract
Electrical connection in an integrated circuit arrangement is facilitated with carbon nanotubes. According to various example embodiments, a carbon nanotube material (120, 135) is associated with another material (130, 125) such as a metal. The carbon nanotube material facilitates the electrical connection between different circuit components.
Claims36
An integrated circuit arrangement comprising:
- an integrated circuit die;
- and
- a carbon nanotube-based composite conductor configured and arranged for electrically connecting electrical components of the integrated circuit arrangement.
An integrated circuit arrangement comprising:
- an integrated circuit substrate;
- and
- a carbon nanotube-based composite interconnect in the substrate and configured and arranged for electrically connecting electrical components of the integrated circuit arrangement, the interconnect including a plurality of carbon nanotubes associated with a non-carbon nanotube material.
An integrated circuit bondwire connector arrangement for connecting integrated circuit components, the bondwire connector arrangement comprising:
- a bondwire including a composite of metal and carbon nanotube-based material extending along a length of the bondwire, the carbon nanotube-based material being arranged for conducting electricity between integrated circuit components.
A method for manufacturing a bondwire arrangement, the method comprising:
- providing a metal core material having a length;
- coupling carbon nanotubes onto the metal core material along the length of the metal core material.
A method for manufacturing a bondwire arrangement (105), the method comprising:
- providing a carbon nanotube core (125) material having a length;
- coupling metal onto the carbon nanotube core along the length of the carbon nanotube core material (135).
An integrated circuit leadframe arrangement comprising:
- a leadframe including a combination of metal and carbon nanotube material, the leadframe configured and arranged for electrically coupling an external circuit component to an integrated circuit die.
A method for manufacturing a carbon nanotube-based interconnect, the method comprising:
- etching a trench in a substrate;
- filling a portion of the trench with a metal material;
- and
- in the trench, coupling carbon nanotubes to a surface of the metal material.
Dependencies are inferred from the claim text.