Semiconductor Device and Method of Supporting a Wafer During Backgrinding and Reflow of Solder Bumps

A method of making a semiconductor device, comprising:

• providing a semiconductor wafer having an active surface;
• forming an under bump metallization layer over the active surface of the semiconductor wafer;
• forming a first photosensitive layer over the active surface of the semiconductor wafer;
• removing a portion of a backside of the semiconductor wafer, opposite to the active surface;
• removing the first photosensitive layer after removing the portion of the backside of the semiconductor wafer;
• and
• depositing solder material over the under bump metallization layer to form solder bumps.

A method of making a semiconductor package, comprising:

• providing a semiconductor wafer having an active surface;
• forming a first layer over the active surface of the semiconductor wafer for structural support;
• removing a portion of a backside of the semiconductor wafer, opposite to the active surface;
• and
• removing the first layer after removing the portion of the backside of the semiconductor wafer.

A semiconductor device, comprising:

• a semiconductor wafer having an active surface;
• an under bump metallization layer formed over the active surface of the semiconductor wafer;
• a first photosensitive layer formed over the active surface of the semiconductor wafer, wherein a portion of a backside of the semiconductor wafer, opposite to the active surface, is removed and the first photosensitive layer is removed after removing the portion of the backside of the semiconductor wafer;
• and
• a plurality of solder bumps formed over the under bump metallization layer.