Stacked solder balls for integrated circuit device packaging and assembly
AssigneeSpansion LLC
InventorsJunji TANAKA, Masahiko HARAYAMA, Masanori ONODERA
Life of this patent
Estimating the term…
Abstract
A semiconductor device is provided that includes a semiconductor chip, a plurality of solder bumps that electrically couple the semiconductor chip to the outside, and a metal bump being provided on the surface of each first solder bump which is at least a part of the plurality of solder bumps and being made of a metal having a melting point higher than that of the first solder bump. The wettability of the first solder bump is improved as each metal bump serves as a core when the corresponding first solder bump melts. Thus, the connection reliability of the first solder bump can be improved.
Claims10
A semiconductor device comprising:
- a semiconductor chip;
- a plurality of solder bumps that electrically couple the semiconductor chip to an external circuit;
- and
- a metal bump disposed on a surface of each first solder bump which is at least a part of the plurality of solder bumps and comprising a metal having a melting point higher than that of the first solder bump.
A method for manufacturing a semiconductor device, comprising the steps of:
- forming a metal bump on a surface of each first solder bump which is at least a part of a plurality of solder bumps that electrically couple a semiconductor chip to an external electrode, the metal bump being made of a metal having a melting point higher than that of the first solder bump;
- and
- bonding the first solder bump on a mounting portion where the semiconductor chip is mounted.
A method for manufacturing a semiconductor device, the method comprising the steps of:
- applying, to a surface of a solder bump that electrically couples a semiconductor chip to an external electrode, a flux containing a metal with a higher melting point than that of the solder bump;
- and
- bonding the solder bump having the surface to which the flux is applied on a mounting portion where the semiconductor chip is mounted.
Dependencies are inferred from the claim text.