Integrated circuit package system with overhang film
AssigneeSTATS ChipPAC, Ltd.
InventorsHye Ran Lee, Sang Ha Hwang, Gyung Sik Yun
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Abstract
An integrated circuit package system includes: connecting a first interconnect between a carrier and a bottom integrated circuit thereover; forming a film, having an overhang portion, over the bottom integrated circuit with the overhang portion over the first interconnect; mounting a top integrated circuit over the film; connecting a second interconnect between the top integrated circuit and the carrier with the overhang portion between the first interconnect and the second interconnect; and forming an encapsulation over the carrier covering the top integrated circuit, the film, the first interconnect, and the second interconnect.
Claims20
An integrated circuit package system comprising:
- connecting a first interconnect between a carrier and a bottom integrated circuit thereover;
- forming a film, having an overhang portion, over the bottom integrated circuit with the overhang portion over the first interconnect;
- mounting a top integrated circuit over the film;
- connecting a second interconnect between the top integrated circuit and the carrier with the overhang portion between the first interconnect and the second interconnect;
- and
- forming an encapsulation over the carrier covering the top integrated circuit, the film, the first interconnect, and the second interconnect.
An integrated circuit package system comprising:
- mounting a bottom integrated circuit over a carrier;
- connecting a first interconnect between the bottom integrated circuit and the carrier;
- forming a film, having an overhang portion, over the bottom integrated circuit with the overhang portion on the first interconnect;
- mounting a top integrated circuit over the film and the bottom integrated circuit;
- connecting a second interconnect between the top integrated circuit and the carrier with the overhang portion between the first interconnect and the second interconnect;
- and
- forming an encapsulation over the carrier covering the top integrated circuit, the film, the first interconnect, the second interconnect, and the bottom integrated circuit.
An integrated circuit package system comprising:
- a carrier;
- a bottom integrated circuit over the carrier;
- a first interconnect between the carrier and the bottom integrated circuit;
- a film, having an overhang portion, over the bottom integrated circuit with the overhang portion over the first interconnect;
- a top integrated circuit over the film;
- a second interconnect between the top integrated circuit and the carrier with the overhang portion between the first interconnect and the second interconnect;
- and
- an encapsulation over the carrier covering the top integrated circuit, the film, the first interconnect, and the second interconnect.
Dependencies are inferred from the claim text.