Thermal interface material design for enhanced thermal performance and improved package structural integrity
AssigneeTexas Instruments Incorporated
InventorsSiva Prakash Gurrum, Paul Joseph Hundt, Vikas Gupta
Life of this patent
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Abstract
An electronic package comprising a semiconductor device, a heat spreader layer, and a thermal interface material layer located between the semiconductor device and the heat spreader layer. The thermal interface material layer includes a resin layer having heat conductive particles suspended therein. A portion of the particles are exposed on at least one non-planar surface of the resin layer such that the portion of exposed particles occupies a majority of a total area of a horizontal plane of the non-planar surface.
Claims20
An electrical device, comprising:
- an electronic package, said electronic package including:
- a semiconductor device mounted to a mounting body;
- a lid surrounding said semiconductor device;
- and
- a thermal interface material layer located between said semiconductor device and at least one of said lid or said mounting body, wherein said thermal interface material layer includes:
- an resin layer having metal particles suspended therein, a portion of said metal particles being exposed on at least one non-planar surface of said resin layer such that said portion of exposed particles occupy a majority of a total area of a horizontal plane of said non-planar surface, and
- an outer solder layer contacting said non-planar surface, and one of said semiconductor device, said lid or said mounting body;
- and
- connective structures, said connective structures being electrically coupled to said semiconductor device to thereby interconnect said electronic package to electronic components mounted on a substrate.
An electronic package, comprising:
- a semiconductor device;
- a heat spreader layer;
- and
- a thermal interface material layer located between said semiconductor device and said heat spreader layer, wherein
- said thermal interface material layer includes a resin layer having heat conductive particles suspended therein, and
- a portion of said metal particles being exposed on at least one non-planar surface of said resin layer such that said portion of exposed particles occupy a majority of a total area of a horizontal plane of said non-planar surface.
A method of manufacturing an electronic package, comprising:
- attaching a semiconductor device to a heat spreader layer, including:
- applying a thermal interface material to a component surface of one of said semiconductor device or said heat spreader layer, wherein said thermal interface material includes a resin layer having heat conductive particles suspended therein, and a portion of said metal particles being exposed on at least one non-planar surface of said resin layer such that said portion of exposed particles occupies a majority of a total area of a horizontal plane of said non-planar surface;
- and
- contacting the other of said semiconductor device or said heat spreader layer to said thermal interface material.
A method of forming a thermal interface material layer, comprising:
- suspending heat conductive particles in a resin to form a particle-resin mixture;
- forming a layer of said particle-resin mixture, wherein said layer has a substantially planar surface;
- and
- etching said planar surface to form a non-planar surface and thereby expose a portion of said particles located at a non-planar surface of said layer, such that said portion of exposed particles occupies a majority of a total area of a horizontal plane of said non-planar surface.
Dependencies are inferred from the claim text.