Ball grid array package layout supporting many voltage splits and flexible split locations

A method of routing a plurality of input/output voltages in a package, comprising the steps of:

• (A) routing a power ground from a ground power set of a plurality of contact pads in a first conductive layer of said package to a ground ring in a second conductive layer of said package, wherein said ground ring surrounds a die attach area of said package;
• (B) routing a core voltage from a core power set of said contact pads to a core ring in said second conductive layer, wherein said core ring surrounds said ground ring;
• and
• (C) routing said input/output voltages from an input/output power set of said contact pads to an input/output ring in said second conductive layer, wherein (i) said input/output ring surrounds said core ring, (ii) said input/output ring is configured to power a plurality of input circuits and a plurality of output circuits of a die mounted in said die attach area, (iii) said input/output ring is split into a plurality of ring segments electrically isolated from each other and (iv) at least one particular segment of said ring segments has a length as measured along said input/output ring of less than a single connector pitch to create location flexibility of said input/output voltages.

A package comprising:

• means for routing a power ground from a ground power set of a plurality of contact pads in a first conductive layer of a package to a ground ring in a second conductive layer of said package, wherein said ground ring surrounds a die attach area of said package;
• means for routing a core voltage from a core power set of said contact pads to a core ring in said second conductive layer, wherein said core ring surrounds said ground ring;
• and
• means for routing a plurality of input/output voltages from an input/output power set of said contact pads to an input/output ring in said second conductive layer, wherein (i) said input/output ring surrounds said core ring, (ii) said input/output ring is configured to power a plurality of input circuits and a plurality of output circuits of a die mounted in said die attach area, (iii) said input/output ring is split into a plurality of ring segments electrically isolated from each other and (iv) at least one particular segment of said ring segments has a length as measured along said input/output ring of less than a single connector pitch to create location flexibility of said input/output voltages.