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US 2009/0212411 A1Published application
Semiconductor device and manufacturing method therefor
AssigneeMitsubishi Electric Corporation
InventorsMasafumi MATSUMOTO, Tatsuya IWASA, Junji YAMADA, Masaru FURUKAWA
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Abstract
A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.
Claims6
A semiconductor device comprising:
- a thermoplastic resin case;
- a semiconductor chip mounted within said thermoplastic resin case;
- a metal terminal having a wire bonding surface and an opposing contact surface;
- and
- a wire connected between said wire bonding surface and said semiconductor chip;
- wherein said contact surface of said metal terminal is thermoplastically bonded at an area to the inside of said thermoplastic resin case.
3 more elements
A method for manufacturing a semiconductor device, comprising the steps of:
- a terminal mounting step of mounting a metal terminal on a thermoplastic resin case at a predetermined location such that a portion of said metal terminal is in contact with said thermoplastic resin case;
- a thermoplastic bonding step of heating said mounted metal terminal by induction heating to a temperature higher than the melting point of said thermoplastic resin case so that said portion of said metal terminal is thermoplastically bonded to said thermoplastic resin case;
- a chip mounting step of mounting a semiconductor chip within said thermoplastic resin case;
- and
- a wire bonding step of connecting said bonded metal terminal to said semiconductor chip by wire bonding.
2 more elements
Dependencies are inferred from the claim text.