Stack die packages
AssigneeMarvell World Trade Ltd.
InventorsAlbert Wu, Huahung Kao
Life of this patent
Estimating the term…
Abstract
An integrated circuit package includes a substrate comprising a first contact. A first integrated circuit mechanically attached to the substrate. The first integrated circuit comprising a second contact. A first redistribution layer arranged on the first integrated circuit. The first redistribution layer includes a trace coupled to the second contact. A first wire connects the first contact to the second contact. A flip-chip integrated circuit comprises a third contact connected to the trace by a conductive bump. A second integrated circuit mechanically coupled to the flip-chip integrated circuit. The second integrated circuit comprises a fourth contact. A second wire connects the fourth contact to at least the second contact or the first contact.
Claims20
An integrated circuit package comprising:
- a substrate comprising a first contact;
- a first integrated circuit mechanically attached to the substrate, the first integrated circuit comprising a second contact;
- a first redistribution layer arranged on the first integrated circuit, the first redistribution layer including a trace coupled to the second contact;
- a first wire connecting the first contact to the second contact;
- a flip-chip integrated circuit comprising a third contact connected to the trace by a conductive bump;
- a second integrated circuit mechanically coupled to the flip-chip integrated circuit, the second integrated circuit comprising a fourth contact;
- and
- a second wire connecting the fourth contact to at least the second contact or the first contact.
An integrated circuit package comprising:
- a substrate comprising a first contact and a second contact;
- a first integrated circuit including
- a first side mechanically attached to the substrate between the first contact and the second contact;
- and
- a second side including a third contact and a fourth contact;
- a first redistribution layer arranged on the second side of the first integrated circuit between the third contact and the fourth contact, the first redistribution layer including a first trace and a second trace respectively coupled to the third contact and the fourth contact;
- a first wire connecting the first contact to the third contact, and a second wire connecting the second contact to the fourth contact;
- a flip-chip integrated circuit including a first side having a fifth contact and a sixth contact, the fifth contact being connected to the first trace by a first conductive bump, the sixth contact being connected to the second trace by a second conductive bump;
- a second integrated circuit including:
- a first side that is mechanically coupled to the flip-chip integrated circuit;
- a second side with a seventh contact;
- and
- a third wire connecting the seventh contact to at least the second contact or the fourth contact.
An integrated circuit package comprising:
- a substrate comprising a first contact;
- a first integrated circuit mechanically attached to the substrate, the first integrated circuit comprising a second contact;
- a first wire connecting the first contact to the second contact;
- a flip-chip integrated circuit comprising a third contact that communicates with the second contact via a conductive bump;
- a second integrated circuit mechanically attached to the flip-chip integrated circuit, the second integrated circuit comprising a fourth contact;
- and
- a second wire connecting the fourth contact to the second contact.
An integrated circuit package comprising:
- a substrate comprising a first contact;
- a first integrated circuit mechanically attached to the substrate, the first integrated circuit comprising a second contact;
- a first wire connecting the first contact to the second contact;
- a flip-chip integrated circuit comprising a third contact that communicates with the second contact via a conductive bump;
- a second integrated circuit mechanically attached to the flip-chip integrated circuit, the second integrated circuit comprising a fourth contact;
- and
- a second wire that connects the fourth contact to the first contact and the second contact.
Dependencies are inferred from the claim text.