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US 2009/0212408 A1Published application
Integrated circuit package system for stackable devices
AssigneeSTATS ChipPAC, Ltd.
InventorsDaeSik Choi, Sang-Ho Lee, Soo-San Park
Life of this patent
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Abstract
An integrated circuit package system comprising: providing a package die; and connecting a connector lead having a first connector end with a protruded connection surface and a lowered structure over the package die.
Claims20
An integrated circuit package system comprising:
- providing a package die;
- and
- connecting a connector lead having a substantially uniform thickness of a first connector end with a protruded connection surface and a lowered structure over the package die.
An integrated circuit package system comprising:
- providing a package die having a package die pad;
- connecting a connector lead having a substantially uniform thickness of a first connector end with a protruded connection surface and a lowered structure near the package die pad;
- and
- applying a package encapsulant over the package die and the connector lead providing the protruded connection surface substantially exposed.
1 more element
An integrated circuit package system comprising:
- a package die;
- and
- a connector lead having a substantially uniform thickness of a first connector end with a protruded connection surface and a lowered structure over the package die.
Dependencies are inferred from the claim text.