Leadframe having mold lock vent

A semiconductor package comprising:

• a leadframe including:
• a die pad including a first major surface and an opposing second major surface defining a thickness and having at least one perimeter edge;
• a mold lock opening spaced from the at least one perimeter edge and extending through the thickness of the die pad between the first and second major surfaces;
• and
• a vent extending from the at least one perimeter edge and to the mold lock opening so that the mold lock opening is in communication with the at least one perimeter edge;
• a semiconductor die attached to the first major surface, leaving the mold lock opening exposed;
• and
• an encapsulating material formed about the semiconductor die and a portion of the first major surface, including covering and filling the mold lock opening and a portion of the vent.

A method of fabricating a semiconductor package, the method comprising:

• forming a leadframe including a die pad having a first major surface and an opposing second major surface defining a thickness, and including at least one perimeter edge, including forming a mold lock opening through the thickness of the die pad between the first and second major surfaces, wherein the mold lock opening is spaced from the at least one perimeter edge and forming a vent through the die pad from the mold lock opening to the at least one perimeter edge so that the mold lock opening is in communication with the at least one perimeter edge;
• attaching a semiconductor die to the first major surface, leaving the mold lock opening exposed;
• and
• encapsulating the semiconductor die and a portion of the first major surface with an encapsulating material, including covering and filling the mold lock opening and a portion of the vent with the encapsulating material.