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US 2009/0212403 A1Published application
Thermally enhanced molded leadless package
AssigneeFairchild Semiconductor Corporation
InventorsYong Liu, Zhongfa Yuan
Life of this patent
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AssigneeFairchild Semiconductor Corporation
InventorsYong Liu, Zhongfa Yuan
Estimating the term…
A molded leadless package (MLP) semiconductor device includes a heat spreader with a single connecting projection extending from an edge of a cap of the heat spreader to a leadframe. The heat spreader can include additional projections on its edges that act as heat collectors and help to secure the spreader in the MLP. The connecting projection is attached to a lead of the leadframe so that heat gathered by the cap can be transferred through the connecting projection to the lead and to a printed circuit board to which the lead is connected. In embodiments, the heat spreader includes a central heat collector projection from the cap toward the die, preferably in the form of a solid cylinder, that enhances heat collection and transfer to the cap. The cap can include fins projecting from its top surface to facilitate radiant and convection cooling.
A packaged semiconductor comprising a substrate, a die, at least one electrical connection between the die and the substrate, and a heat spreader thermally connected to the substrate, the heat spreader comprising at least one heat collector extending toward the die, a cap over the die from which the at least one heat collector extends, and at least one connecting projection thermally connecting the cap to the substrate, the package further comprising molding compound between the substrate and cap of the heat spreader so as to encapsulate the die and other components between the substrate and the cap.
The packaged semiconductor of claim 5 wherein the heat path further comprises the at least one connecting projection.
A method of making a semiconductor device comprising providing a substrate with at least one lead, placing a die on the substrate, attaching the die to the substrate with die attach material, electrically connecting the die to the at least one lead, providing a heat spreader with a cap and at least one connecting projection extending from the cap to the substrate, placing the heat spreader over the die so that the at least one connecting projection is in proximity to the substrate, and attaching the at least one connecting projection to the substrate, injecting insulating molding compound to protect and house the die, die attach material, substrate, bond wires, and heat spreader to yield a molded device, singulating by sawing the molded device to form the semiconductor device.
A heat spreader for a semiconductor device comprising a cap, at least one heat collector, at least one connecting projection extending from the cap, and a primary heat path passing through the at least one heat collector and the cap.
A premolded leadframe comprising at least one lead, each lead including a die attach area over which a portion of a die of a semiconductor device can reside and to which a portion of a die can be thermally connected, and molding material supporting the at least one lead.
Dependencies are inferred from the claim text.