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US 2009/0212402 A1Published application
Semiconductor device
AssigneeNEC Electronics Corporation
InventorYasutaka NAKASHIBA
Life of this patent
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Abstract
Disclosed is a semiconductor device which includes a semiconductor chip and a base substrate. The semiconductor chip includes a semiconductor substrate, an interconnect layer and a high-frequency interconnect. The interconnect layer is provided on the substrate. The high-frequency interconnect is formed within the interconnect layer. The semiconductor chip is mounted onto the base substrate. An electromagnetic shield layer is provided between the high-frequency interconnect and the interconnect.
Claims8
A semiconductor device comprising:
- a first substrate having an interconnect;
- a second substrate provided over said first substrate and having an interconnect layer provided thereon, said interconnect layer including a high-frequency interconnect;
- and
- an electromagnetic shield layer provided between said high-frequency interconnect and said interconnect of said first substrate.
1 more element
Dependencies are inferred from the claim text.