Package system for shielding semiconductor dies from electromagnetic interference

A package system comprising:

• providing a semiconductor die with a contact pad and ground pad;
• mounting the semiconductor die on a package substrate using and adhesive layer;
• connecting the contact pad in the semiconductor die to the package substrate using a bond wire;
• forming a vertical conductive structure on top of the ground pad in the semiconductor die;
• encapsulating at least portions of the semiconductor die, the vertical conductive structure, the bond wire, and the package substrate using an encapsulant;
• covering at least portions of the encapsulant and the vertical conductive structure with a shielding layer to place the vertical conductive structure in electrical contact with the shielding layer;
• and
• connecting the shielding layer to the package substrate.

A package system comprising:

• a semiconductor die with a contact pad and a ground pad;
• a package substrate for supporting the semiconductor die;
• a vertical conductive structure defined on top of the ground pad;
• an encapsulant for encapsulation of at least portions of the semiconductor die, the bond wire, and vertical conductive structure;
• and
• a shielding layer connected to the vertical conductive structure for providing shielding from electromagnetic interference.