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US 2009/0212400 A1Published application
Semiconductor device and manufacturing method and mounting method thereof
OwnerYasuhide HARAinventor
Life of this patent
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Abstract
A semiconductor device includes: a semiconductor substrate having an active region on a surface thereof; at least one electrode pad provided in a peripheral portion of the surface of the semiconductor substrate; and a through electrode extending through the semiconductor substrate and connected to the electrode pad. A taper is provided on at least one side of the semiconductor substrate, whereby a portion of the through electrode which is exposed to a side of the semiconductor substrate serves as an external electrode.
Claims9
A semiconductor device, comprising:
- a semiconductor substrate having an active region on a surface thereof;
- at least one electrode pad provided in a peripheral portion of the surface of the semiconductor substrate;
- and
- a through electrode extending through the semiconductor substrate and connected to the electrode pad, wherein a taper is provided on at least one side of the semiconductor substrate, whereby a portion of the through electrode which is exposed to a side of the semiconductor substrate serves as an external electrode.
1 more element
A method for manufacturing a semiconductor device, comprising the steps of:
- (a) preparing a semiconductor wafer having a plurality of chip regions that are to be diced into individual semiconductor devices;
- (b) in each of the plurality of chip regions, providing at least one electrode pad on a peripheral portion of a surface having an active region and providing a through electrode extending from a back surface of the semiconductor wafer to the electrode pad;
- (c) after the step (b), cutting a peripheral portion of the back surface in each of the plurality of chip regions to expose the through electrode to a side of the chip region so that the exposed portion serves as an external electrode;
- and
- (d) after the step (c), the plurality of chip regions are diced into individual semiconductor devices.
2 more elements
Dependencies are inferred from the claim text.